Speech theme:

E-Beam Metrology and Material Engineering - Enabling High-Yield Mass Production of Advanced Panel-Level Packaging (PLP)

Speech summary:

Advanced packaging has become a key enabler for the growth of AI and high-bandwidth computing. As the industry accelerates the transition from wafer-level packaging to panel-level packaging (PLP) to achieve better cost efficiency and higher manufacturing throughput.

Overcoming key PLP challenges—including warpage, heterogeneous material integration, and yield optimization—requires breakthrough innovation. By combining industry-leading e-beam inspection and metrology with advanced material engineering, we deliver sub-micron defect detection, precision 3D metrology, and high-reliability thin-film solutions that accelerate yield ramp-up and enable high-volume PLP manufacturing.