Speech theme:

Breaking Through the Display Field: ACF Innovation for the AI and Advanced Packaging Era

Speech summary:

With rapid advances in AI and semiconductor packaging, Anisotropic Conductive Film (ACF) is expanding beyond traditional display applications.

This presentation highlights innovation in three areas: Beyond Display, Smart Manufacturing, and Next Packaging.

ACF is evolving from a display-specific material into a high-end interconnection solution for semiconductors and electronic components.

AI and AOI integration is driving smart manufacturing, improving defect detection accuracy, yield, and full-process traceability for reliable quality control.

In advanced packaging, panel manufacturers are entering panel-level packaging. Leveraging its expertise, our company is developing new materials to support large-scale packaging and cost optimization.